On the Donor

In 1992, CLP Power offered a number of scholarships to the University in recognition of the academic excellence of students in the Electrial Engineering programme.

In 2012, CLP Power Hong Kong Limited contributed a generous sum to establish a scholarship in support of outgoing student exchange for outstanding undergraduate Engineering students, to widen students' horizons and promote experiential learning.

Purpose and Scope

The Scholarship shall support students' participation in outgoing exchange programme at overseas universities that enhance their international exposure and learning.

The scholarship recipients shall be required to join CLP as interns and be invited to participate in the CLP Engineering Studies Award (ESA) selection.  If they are selected as ESA awardees, they will join CLP as Graduate Trainee upon graduation.

The scholarship shall be of a maximum value of HK$200,000 each, which covers the tuition fees, accommodations, travel expenses between the partner institution and Hong Kong, and the awardee's living expenses in the country of the partner institution for one semester.